Parameters and limitations of projects:
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maximal
board size: 260x560 mm
|
| - |
minimal
element package size: 0201 SMD
|
| - |
IC's packages: uBGA, BGA, FinePitch 12 mil, QFP, TQFP, QFN, PLCC,
MiniMelf, MicroMelf
|
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non-typical
sized and odd-shaped elements assembly
|
Automatic assembly:
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brand
new ultra precision SMT line with the performance of 10 000 cph |
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three
independent Pick&Place machines with the performance of 2800
cph each.
|
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monthly
production capability reaching 6 million elements
|
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inspection
of correct element placement
|
| - |
soldering
in a DIMA reflow oven. The oven is prepared for lead-free technology
|
| - |
inspection
of solder joints correctness and product correspondence with the
assembly documentation (stereoscope microscopes with zoom from 10x to
55x)
|
Manual assembly (SMT):
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solder
paste placed with a dispenser or through a stencil
|
| - |
manual
positioning of elements
|
| - |
soldering
in a DIMA reflow oven
|
This
technology is very useful in realization of prototype projects (up to
10 PCBs)
Supplement assembly (THT):
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manual
elements placing and soldering
|
| - |
we
use PACE soldering stations (prepared for lead-free technology)
|
Active
elements provided by customer are baked in an oven according to the
producer's indications before the assembly
Laser cut or acid etched SMT stencils
provide faultless solder paste placing and perfect solder joints.
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|
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