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Parameters and limitations of projects:
| - | maximal board size: 260x560 mm |
| - | minimal element package size: 0402 SMD |
| - | active element packages: uBGA, BGA, FinePitch 12 mil, QFP, TQFP, QFN, PLCC, MiniMelf, MicroMelf |
| - | non-typical sized and odd-shaped elements assembly |
Automatic assembly:
| - | three independent Pick&Place machines with the performance of 2800 cph each. |
| - | monthly production capability reaching 3 million elements |
| - | inspection of correct element placement |
| - | soldering in a DIMA reflow oven. The oven is prepared for lead-free technology |
| - | inspection of solder joints correctness and product correspondence with the assembly documentation (stereoscope microscopes with zoom from 10x to 55x) |
Manual assembly (SMT):
| - | solder paste placed with a dispenser or through a stencil |
| - | manual positioning of elements |
| - | soldering in a DIMA reflow oven |
This technology is very useful in realization of prototype projects (up to 10 PCBs)
Supplement assembly (THT):
| - | manual elements placing and soldering |
| - | we use PACE soldering stations (prepared for lead-free technology) |
Active elements provided by customer are baked in an oven according to the producer's indications before the assembly
Laser cut or acid etched SMT stencils provide faultless solder paste placing and perfect solder joints.
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